See all the technical specifications
Features & Benefits
- Automated soldering process
- Compact and robust design
- Vision alignment system with fixed beam splitter
- Intelligent thermal management
- Real time process observation camera
- User‐independent process operation
- Cost‐effective system to perform the whole rework cycle
- Reproducible placement accuracy
- Intelligent thermal management
- Immediate visual feedback reduces process development times
Technical specifications
| CW | CWplus | |
| Placement accuracy | 25 μm | |
| Field of view min. / max. | 12.1 mm x 7.6 mm / 65 mm x 45 mm | |
| Component size min. / max. | 0.25 mm x 0.25 mm / 60 mm x 60 mm | |
| Reflow module | 900 W | |
| Temperature ramp rate | 1 K/s - 50 K/s | |
| Flow range | 10 Nl/min - 70 Nl/min | |
| Board heater | 900 W | 1 600 W |
| Heated area (max.) | 100 mm x 1000 mm | 280 mm x 192 mm |
| Flow range | 10 Nl/min - 70 Nl/min | 10 Nl/min - 160 Nl/min |
| Thermocouples² | 4 | |
