Jade PRO / Jade PRODEX

Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade PRO offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.

The Jade PRO is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 457 x 508mm.

In its basic format, the Jade PRO is configured with a single solder bath. In the Jade Duplex guise, the machine can be configured with twin adjacent solder baths on independent Z axis drives. This achieves increased production flexibility by permitting use of two different nozzle tip sizes which can be allocated as process requirements dictate within any particular area on a PCB. Alternatively the Prodex configuration offers a rotary table twin tooling carrier for rapid PCB load/unload.

All of the above Jade PRO configurations can be offered with optional automatic heated solder bath change stations. Using this system the non operational solder bath and pump system is stationed at one of two heated park positions located at either side of the main machine. This heated station, maintains the correct solder temperature within the bath that is idle so that when changeover on the fly occurs, the replacement bath can resume immediate production. A single automatic solder bath change station is identified as a PLUS configuration, whilst twin stations (located at both sides of the machine) are identified as PLUS PLUS configurations. On this basis Duplex machines with the PLUS PLUS identity will operate with 4 individual solder bath and pump systems. Solder baths are individually tagged so that incorrect solder alloys cannot be selected with respect to any specific customer generated program. The operational solder bath(s) has its own allocated solder feeder which is also tagged in order to prevent incorrect solde

Video vague sélective hors ligne Jade Prodex


  • Height (excluding light tower):1230mm (48”)
  • Width: 1250mm (49“)
  • 1700mm (67”) (With single side Auto changer)
  • Depth (Jade Pro/Duplex): 1495mm (59”)  (Jade Prodex): 2020mm (79½”)
  • Board Size: 457mm x 508mm (18” x 20”) (larger PCB size available
  • Edge Clear ance: upon request)
  • Height Clearance: Above / below 3mm
  • Above / below 40mm nominal, 90mm max.
  • Solder: All commonly used solder types (including Lead Free).
  • Solder Pot Capacity: 8kg standard bath
  • 20kg large bath
  • Applicators: AP-1 style (2.5, 3, 4, 6, 8, 10, 12mm)
  • Patented 1.5mm micro nozzle
  • Extended and Jet-Tip nozzles (up to 25mm dia)
  • Jet-Wave nozzles (up to 25mm width)
  • Special dedicated nozzles available upon request
  • Flux: Low maintenance drop-jet system. Low solids, no clean flux, pressurised and inerted system, optional water soluble system available
  • X, Y & Z Axis Resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen Usage: 35 litres gas/min per bath using standard AP solder
  • nozzle, 5 bar pressure
  • Nitrogen Purity: 99.995% or better
  • Power Supplies: Three phase + Neutral + PE
  • Voltage: 230 Volts Phase to Neutral
  • Frequency: 50/60Hz
  • Power: Maximum 6 kVA per phase
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps
  • Programming: Windows® based PillarCOMM ‘Point & Click’ programming



  • DC Servo Drives with encoders on X, Y & Z axis
  • Integral PC and machine mounted TFT monitor
  • Inerted nitrogen system
  • Auto solder top-up (wire feed) & solder level detect
  • Drop -jet fluxer
  • Two AP-1 solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Universally adjustable tooling carrier
  • PillarCOMM windows software
  • Lead free compatible



  • Ultrasonic fluxing
  • Dual drop-jet / ultrasonic fluxing
  • Flux presence sensor
  • Flux flow monitoring
  • Pump rpm monitoring
  • Nitrogen ppm monitoring
  • Topside instant I.R. pre-heat
  • Bottom side slide in/out I.R. pre-heat
  • Closed loop temperature control system via pyrometer
  • Solder wave height measurement and correction system
  • Twin solder bath capability on independent Z axis (Duplex)
  • Rotary table adjustable twin tooling carrier (Prodex)
  • Large solder bath for dedicated single dip applications
  • Manual or automatic fiducial correction system
  • Laser board warpage control
  • Process viewing camera
  • Multiple level password protection
  • 1.5mm micro nozzle
  • PillarPAD offline programming system
  • Nitrogen flow monitoring
  • Solder reel identification
  • Solder bath coding (identifies correct bath for program)
  • Larger PCB handling size
  • Nitrogen generator

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