Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB\u2019s up to 330mm x 510mm (fluxer, pre-heat, solder, solder). For high speed applications this same unit can be configured as fluxer\/pre-heat and up to three solder modules with as many as five heater options. An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station (this configuration reduces PCB handling capability to 330mm x 250mm).
Each solder cell can be configured with any of the currently available Pillarhouse solder technologies:- custom dip, multi-dip, jet-wave and single point AP down to the patented 1.5mm micro nozzle.
Easy, rapid non-contact solder pot change over is facilitated via the optional heated pot exchange trolley.<\/p>\n
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TECHNICAL SPECIFICATIONS
Height (excluding light tower):1380mm (54\u201d)
Width: 2193mm (86\u00bd\u201c) Compact
2930mm (115\u00bd\u201d) Standard
Depth: 1520mm (60\u201d)
Board Size: Maximum PCB handling size 1113mm x 610mm
(43.8\u201d x 24\u201d). Standard frame with 2 stations.
For further details of PCB handlingn capability refer to attachment.
Edge Clearance: Above \/ below 3mm
Height Clearance: Above \/ below 40mm nominal, 70mm max.
Solder: All commonly used solder types (including Lead Free).
Solder Pot Capacity:8kg standard bath
20kg large bath
Applicators: AP-1 style (2.5, 3, 4, 6, 8, 10, 12mm)
Extended and Jet-Tip nozzles (up to 25mm dia)
Jet-Wave nozzles (up to 25mm width)
Special dedicated nozzles available upon request
Flux: Low maintenance drop-jet system. Low solids, no clean flux, pressurised and inerted system, optional water soluble system available
X, Y & Z Axis Resolution: 0.15mm
Repeatability: +\/- 0.05mm
Nitrogen Usage: 35 litres gas\/min per bath using standard AP solder
nozzle, 5 bar pressure
Nitrogen Purity: 99.995% or better
Power Supplies: Three phase + Neutral + PE
Voltage: 230 Volts Phase to Neutral
Frequency: 50\/60Hz
Power (no I.R preheat): TBA
(with I.R preheat): TBA
Transport: Motorised Conveyor
Programming: Windows\u00ae based PillarCOMM \u2018Point & Click\u2019 programming<\/p>\n
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STANDARD FEATURES
\u2022 In-line motor driven width adjust through feed conveyor<\/p>\n
\u2022 Conveyor side clamping<\/p>\n
\u2022 DC Servo Drives with encoders on X, Y & Z axis<\/p>\n
\u2022 Integral PC and machine mounted TFT monitor<\/p>\n
\u2022 Inerted nitrogen system<\/p>\n
\u2022 Motorised wire feed auto solder top-up & solder level detect<\/p>\n
\u2022 Drop -jet fluxer<\/p>\n
\u2022 Two AP-1 solder nozzle tips<\/p>\n
\u2022 Internal fume extraction<\/p>\n
\u2022 Colour programming camera<\/p>\n
\u2022 PillarCOMM windows software<\/p>\n
\u2022 Lead free compatible<\/p>\n
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OPTIONS
\u2022 Ultrasonic fluxing<\/p>\n
\u2022 Dual drop-jet \/ ultrasonic fluxing<\/p>\n
\u2022 Flux presence sensor
\u2022 Flux flow monitoring<\/p>\n
\u2022 Pump rpm monitoring<\/p>\n
\u2022 Nitrogen ppm monitoring
\u2022 Topside instant I.R. pre-heat<\/p>\n
\u2022 Bottom side I.R. pre-heat<\/p>\n
\u2022 Closed loop temperature control system via pyrometer<\/p>\n
\u2022 Solder wave height measurement and correction system<\/p>\n
\u2022 Large solder bath for dedicated single dip applications<\/p>\n
\u2022 Automatic fiducial correction system<\/p>\n
\u2022 Laser board warpage control<\/p>\n
\u2022 Process viewing camera<\/p>\n
\u2022 Multiple level password protection<\/p>\n
\u2022 1.5mm micro nozzle<\/p>\n
\u2022 PillarPAD offline programming system<\/p>\n
\u2022 Nitrogen flow monitoring<\/p>\n
\u2022 Solder reel identification<\/p>\n
\u2022 Solder bath coding (identifies correct bath for program)<\/p>\n
\u2022 Larger PCB handling size<\/p>\n
\u2022 Nitrogen generator<\/p>\n
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