Automated programming system AP 760

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Video Automated programming system AP 760

Features

  • Universal automatic programmer of IC components
  • Proprietary 4-nozzle gantry for handling 4 devices at each programming cycle
  • Up to 9 (4 sockets x 9 sites) programming sockets
  • Throughput up to 2400 units per hour
  • H9800 Universal Programmers with 16 Gbits of RAM on each programmer
  • Insertion alignment for pick-up offset by “Precisor” or dual CCD cameras
  • I/O : plateaux JEDEC / Barettes /Bobines
  • Device support: EPROM, EEPROM, Flash, Microcontrollers, PLD, CPLD, FPGA and more.
  • Package types: SOIC, PLCC, BGA, MLF, QFN…
  • Matching four I/O peripherals to the quad-site gantry increases system throughput

 

Specifications AP760

Pick & Place System & Physical Specifications

  • Placement accuracy: ±0.05m
  • Placement repeatability: ±0.03 mm
  • Placement force: 95 grams
  • Pick-and place method: 4 buses d’aspiration
  • Component detection: Vacuum sensor
  • Dimension: 180(L) x 120(W) x 165(H) cm;
  • Shipping dimension: 227(L) x 165(W) x 205(H) cm;
  • Net Weight: 1028 kg
  • Shipping Weight: 1328 kg
  • Norma : CE Compliant

* Weight may vary with option and sub assembly order

Position recognition system

  • X-Y drive system: Servo motor drive system
  • X axes resolution: 0.003mm
  • Y axes resolution: 0.003mm
  • X-Y axes repeatability: 0.030mm
  • X-axis maximum velocity: 1600mm/sec
  • Y-axis maximum velocity: 1600mm/sec
  • Z-theta drive system: Servo motor
  • Z axis resolution: 0.001mm
  • Z axis repeatability: 0.030mm
  • Z axis maximum velocity: 300mm/sec

 

Alignment System

  • CCD FOV: 35mm x 35mm
  • Mechanical Precisor: 30mm x 30mm x 4 precisors

Programming System

  • Programming sites: 9 sites
  • Programming sockets: 1, 2 or 4 per site
  • Devices supported: EPROM, EEPROM, Flash,PLD, CPLD,FPGA ,
  • Micro-controllers, Anti-Fuse, and more.
  • Packages supported: PLCC, TSOP, TSSOP, TQFP, PQFP, SOIC,SSOP, μBGA, CSP and more.
  • Model H9800 RAM Buffer: 16 Gbits default
  • Communications: USB 2.0

 

System Software

  • GUI: Windows-based HMI
  • OS: Microsoft® XP Professional

 

Operating Requirements

  • Input voltage: 220 VAC, Single phase, 3-wires.
  • Input line frequency: 50/60 Hz
  • Power consumption: 2.5 KVA
  • Air pressure: 75 to 95 PSI (0.4 to 0.6Mpa)
  • Air flow: 160 liters/min (Peak)
  • Operation temperature range:15° to 30°C (59°-86°F)
  • Relative humidity: 35-90%

 

Optional Subsystems

  • Tape In / Out: 8mm to 56mm
  • Tube In /Out: SOIC8 to PLCC84
  • Tray In / Out: JEDEC trays up to 20 plates
  • Label Feeder: Hover Davis
  • Laser Marker: CO2 (10W)
  • 3DX Lead Inspection: 45mm x 45mm